Director, Physical Design

Location: Hyderabad, India

About Astera Labs

Astera Labs is a global leader in purpose-built connectivity solutions for AI and cloud infrastructure. Our semiconductor products power the world's leading cloud service providers, hyperscalers, and server OEMs. As we scale our next-generation ASIC programs, we are building a world-class Physical Design team in Hyderabad to drive silicon success from RTL to GDSII.

Role Overview

Astera Labs is seeking a Director, Physical Design to lead and grow our Physical Design function in Hyderabad. This is a senior leadership role responsible for building and managing a high-performing PD team, driving physical implementation of complex, high-speed connectivity ASICs, and establishing best-in-class design methodology and flows.

The ideal candidate brings deep hands-on expertise in full-chip physical design at advanced nodes, a proven track record of successful tapeouts, and the leadership ability to scale a team and deliver results in a fast-paced, high-growth environment. This role will work closely with global PD, RTL, DV, DFT, and packaging teams to ensure first-pass silicon success.

Key Responsibilities

Leadership & Team Building

• Build, lead, and mentor a high-performing Physical Design team in Hyderabad across PnR, STA, EMIR/Power Integrity, and CAD/methodology functions
• Define team structure, hiring roadmap, and career development paths for PD engineers
• Foster a culture of technical excellence, ownership, and continuous improvement
• Partner with global PD leadership (US and Israel sites) to align on strategy, methodology, and execution priorities

Physical Design Execution

• Own end-to-end physical implementation of complex SoCs/ASICs from floor planning through GDSII signoff
• Drive floor planning, placement, clock tree synthesis (CTS), routing, timing closure, power analysis (IR drop/EM), and physical verification (DRC/LVS)
• Lead timing closure across multiple corners and modes (MMMC), ensuring robust STA signoff at advanced nodes (5nm and below)
• Oversee power integrity and reliability analysis (IR drop, EM) to meet design quality and manufacturability targets
• Manage tapeout schedules,milestones, and cross-functional dependencies to deliver on time and within PPA targets

Methodology & CAD

• Establish and continuously improve PD flows, methodologies, checklists, and best practices for first-pass success
• Evaluate and deploy EDA tools (Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Calibre, RedHawk/Voltus, StarRC, etc.)
• Drive automation and scripting (Tcl, Python, Perl) to improve turnaround time and design quality
• Collaborate with EDA vendors on tool evaluation, adoption, and methodology improvements

Cross-Functional Collaboration

• Partner closely with RTL, DV, DFT, packaging, and architecture teams to enable seamless integration of complex subsystems (SerDes, high-speed PHYs, die-to-die interfaces, etc.)
• Provide physical design input during architecture and floorplan feasibility studies, die sizing, and IP evaluation
• Represent the Hyderabad PD team in global design reviews, tapeout readiness reviews, and leadership forums

Basic Qualifications

• Bachelor's or master’s degree in electrical engineering, Electronics, or Computer Science
• 18+ years of experience in ASIC physical design, with at least 5 years in a leadership or management role
• Should be hands on with a proven track record of multiple successful tapeouts at advanced nodes (7nm or below); experience at 5nm/3nm strongly preferred
• Deep hands-on expertise in full-chip physical design: floorplanning, PnR, CTS, STA, IR/EM analysis, and physical verification
• Strong proficiency with industry-standard EDA tools: Cadence Innovus, Synopsys Fusion Compiler/IC Compiler, PrimeTime, Calibre, RedHawk/Voltus
• Experience with high-speed interface IPs such as SerDes, PCIe, CXL, or die-to-die (D2D/UCIe) interconnects
• Strong scripting skills in Tcl, Python, or Perl
• Demonstrated ability to build and lead global, cross-functional engineering teams

Preferred Qualifications

• Experience with chiplet architecture, UCIe interfaces, or die-to-die physical integration
• Familiarity with low-power design techniques (UPF/CPF, multi-voltage domains)
• Experience working with TSMC advanced nodes and TSMC tapeout processes
• Background in networking, storage, or AI/ML SoC designs
• Strong cross-functional collaboration skills with RTL, DFT, packaging, and silicon operations teams
• Experience establishing a PD center of excellence or greenfield PD team

Why Astera Labs

• Work on cutting-edge connectivity ASICs powering the world's largest AI and cloud infrastructure
• Join a high-growth, publicly traded semiconductor company with a strong innovation culture
• Lead and shape a strategic PD center in Hyderabad with global impact
• Competitive compensation including base salary, performance bonus, and RSU equity.