Overview

Drive the design, bring-up, validation, and optimization of high-volume consumer electronics hardware as an Electrical Engineer. This role focuses on supporting end-to-end EE activities—from PCB design and stackup to hands-on new hardware bring-up and troubleshooting—while collaborating with cross-functional teams to ensure robust, manufacturable, and high-performance subsystems including cameras, sensors, and display engines.

Responsibilities

• Collaborate with product design (PD), mechanical, and firmware teams to deliver optimized, production-ready hardware.
• Manage and execute hardware bring-up, debug, validation, and troubleshooting processes for new hardware builds, including root cause analysis and design optimization.
• Conduct signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC) analysis; drive design changes for compliance with EMC and ESD requirements.
• Validate and optimize high-speed (e.g., CPHY, DPHY) and low-speed (e.g., I2C, SPI) interfaces; oversee implementation and verification of clock architectures.
• Integrate and support subsystems such as cameras, sensors, and display engines, including assessment of flex designs and bend region reliability.
• Utilize following experience for overall product optimization: design, placement, and routing of complex printed circuit boards (PCBs) using tools such as Cadence, OrCAD, and Allegro, including stackup definition for rigid and flex circuits.

Minimum Qualifications

• Proven expertise in PCB design using Cadence, OrCAD, and Allegro, with hands-on experience in placement, routing, and stackup configuration.
• Demonstrated experience with flex PCB design, including understanding of bend regions and reliability concerns.
• Hands-on ownership of hardware bring-up, debug, and root cause analysis for new board designs in high-volume consumer electronics.
• Strong understanding of signal and power integrity principles, SI/PI analysis methodologies/measurements, and exposure to EMC/ESD mitigation.
• Practical experience working with high-speed interfaces (CPHY, DPHY) and common low-speed buses (I2C, SPI).
• Familiarity with subsystem integration for cameras, sensors, and display engines.
• Advanced troubleshooting of SI/PI issues using industry-standard lab tools.

Preferred Qualifications

• Prior involvement in design validation and optimization for mass-production consumer electronics.
• Experience collaborating directly with PD, system, mechanical, and test engineering teams in a fast-paced manufacturing environment.
• In-depth understanding of clocking topologies and timing analysis for complex subsystems.
• Background in failure analysis and reliability engineering for flex designs and mechanically constrained environments.