Head of Test Development Engineering

Summary:

The Head of Product Development Engineering will be responsible for taking Ethernovia’s products from NPI to HVM.

This position requires a leader who is hands-on with semiconductor test development. You will bridge the gap between world-class networking chip designs and high-volume, automotive-grade silicon testing. The position is based in San Jose, CA.

Key Responsibilities:

• End to end, test architecture, infrastructure, hardware and methodology ownership from pre-silicon to post-silicon, working with Arch, Design, Desing verification, DFT, Security, SW/FW, System, Product and Q&R.
• Own early engagement with Arch/DFT, System/SW and Security, on ATE and SLT test architecture and DFM / DFD to ensure debug ability and testability to spec.
• Deliver manufacturing test programs from NPI bring-up to high volume manufacturing for high-speed Ethernet switch and PHY products ensuring signal integrity and power/performance standards are maintained at scale.
• Own design of test boards ensuring SI/PI and test implementation across wafer test, final test and system level test, ensuring robustness and meeting test time.
• Manage test labs, OSAT (test house), engagement with vendors for tester, prober, probe card, load board, system board, socket, handler, change kit and TCU.

Required Experience & Skills: Professional Background

• Bachelor's or Master's degree in Electrical Engineering or a related technical field
• 12+ years of experience in fabless semiconductor operations, specifically for complex, high-performance SOCs or networking ICs.
• Expert in ATE 93K platform and Smartest, test method libraries and design of test hardware with robust SI/PI for wafer and final test.
• Expertise with iJTAG, Scan (SSN), MBIST, Sensor, SerDes, LSIO/HSIO testing, security fusing and test automation for multi-site (x8, x16) parallel testing.
• Expert in SLT testing using bare-metal, functional DVFS and benchmark testing and expert in multi-site handler automation framework and test log standards.
• Experience with Analog characterizing high-speed communication chips on ATE and System to ensure all IO parameters are characterized and tested.
• Experience defining DFT/DFM/DFD requirements for Ethernet PHY and Switch products and experience with scan and memory dump for debug.
• Experience navigating the Automotive electronics ecosystem, including IATF 16949, ISO 26262, Safe launch and PPAP (Production Part Approval Process).

Technical Leadership & Skills:

• Understanding of high-bandwidth data-path products (Ethernet, Switching, or high-speed SerDes).
• Expert level experience with ATE and SLT test hardware, test program development, high speed IO analog characterization and test automation.
• Understanding of product life cycle from concept to end of life and leading pre-silicon review and readiness to enable seamless post-silicon bring-up

Nice to Have (The "Competitive Advantage"):

• Experience with simulation, pattern generation, and pattern conversion.
• Experience delivering high speed SerDes products to Tier-1 automotive OEMs.
• Experience negotiating with and managing hardware vendors and OSATs.

What You Can Expect From Ethernovia:

• Technology depth and breadth expansion that can’t be found in a large company
• Opportunity to grow your career as the company grows
• Pre IPO stock options
• Cutting edge technology
• World class team
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance for employees

Salary Range:

• The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $220,000 - $280,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, in addition to base salary and a full range of medical and other benefits.

• Principals Only (No Agencies)

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