Job Description:

As an Analog/Mixed-Signal IC Design Engineer , you will be part of a key team designing sophisticated advanced node CMOS products. Your responsibilities will include developing and verifying circuits such as PLL, DLL, ADC, regulators, amplifiers, TX, RX, and CDRs to meet performance targets. You will also work on analog and clocking blocks for connectivity applications, using industry-standard tools like Spectre and MATLAB. The company seeks a highly motivated designer for this role

Basic Qualifications:

• Pursuing a Master’s or PhD degree in EE is preferred

Desired Experience:

• Hands-on experience in designing high-speed mixed-signal circuits including ADC/DAC data converters, RX front-end, TX driver/serializer, low-jitter PLLs, TX/RX calibration, low-jitter CLK distribution are other high-speed analog circuits is a must
• Have a deep understanding of biasing, band-gaps, reference circuits, opamps, comparators and other analog circuits
• Solid track-record for implementation of analog circuits high-speed data transmission.
• Design and tapeout experience in advanced CMOS nodes (ex. 20nm or newer) is a must
• Solid fundamentals in detailed transistor-level design, feedback/stability analysis, and noise/jitter analysis.
• Knowledge of TIA design and drivers for optical applications is highly desirable
• Experience in RFIC design for wireless or wireline communication systems is highly desirable.
• Strong technical independent contributor with a proven ability to drive results.
• Excellent teamwork, presentation, and documentation skills.
• Ability to collaborate with global teams across multiple time zones and deliver under pressure with strict deadlines.
• Strong experience in lab chip bring-up and debugging efforts.
• Relevant research publications and/or patents in analog or RF IC design.
• Familiarity in programming/scripting languages such as Python, Matlab, or C.
• Experience with PCB design.
• Familiarity with Verilog RTL or DSP design concepts.
• Knowledge of optical transceivers.
• Expertise in ESD protection techniques and IC packaging methodologies.